• Compatible with MLCC footprint

• Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to +150 °C)

o Voltage <-0.02/Volt

o Negligible capacitance loss through ageing

• Low profile 0.1mm

• Small size 0.25 x 0.25 mm (0101 format)• Break down voltage : 150V

• Low leakage current

• High reliability

• High operating temperature (up to 150 °C)

• Compatible with high temperature cycling

during manufacturing operations (exceeding 300 °C)

• Compatible with EIA 0101 footprint

• Applicable for standard wire bonding assembly (ball and wedge)