1 Features

• AEC-Q100 qualified for automotive applications:

– Temperature grade 1: –40°C to +125°C, TA

• – Documentation available to aid functional safety

system design

• 4.5-V to 35-V (40-V abs. max) operating range

• VQFN-HR package: RON_LS + RON_HS: 32 mΩ

• HTSSOP package: RON_LS + RON_HS: 40 mΩ

• IOUT Max = 32 A

• PWM frequency operation up to 25 KHz with

automatic dead time assertion

• Configurable slew rate and spread spectrum

clocking for low electromagnetic interference (EMI)

• Integrated current sense (eliminates shunt resistor)

• Proportional load current output on IPROPI pin

• Configurable current regulation

• Protection and diagnostic features with

configurable fault reaction (latched or retry)

– Load diagnostics in both the off-state and onstate

to detect open load and short circuit

– Voltage monitoring on supply (VM)

– Over current protection

– Over temperature protection

– Fault indication on nFAULT pin

• Supports 3.3-V, 5-V logic inputs

• Low sleep current - 1μA typical at 25°C

• 3 variants - HW (H), SPI (S) or SPI (P)

• Configurable control modes:

– Single full bridge using PWM or PH/EN mode

– Two half-bridges using Independent mode

• Device family comparison table

2 Applications

• Automotive brushed DC motors, Solenoids

• Door modules , wiper modules , trunk and seat

modules

• Body control module (BCM)

• E-Shifter

• Steering systems

• Gas engine systems

• On board charger

3 Description

The DRV824x-Q1 family of devices is a fully

integrated H-bridge driver intended for a wide

range of automotive applications. The device can

be configured as a single full-bridge driver or as

two independent half-bridge drivers. Designed in a

BiCMOS high power process technology node, this

monolithic family of devices in a power package

offer excellent power handling and thermal capability

while providing compact package size, ease of layout,

EMI control, accurate current sense, robustness, and

diagnostic capability. This family provides an identical

pin function with scalable RON (current capability) to

support different loads.

The devices integrate a N-channel H-bridge, charge

pump regulator, high-side current sensing with

regulation, current proportional output, and protection

circuitry. A low-power sleep mode is provided to

achieve low quiescent current. The devices offer

voltage monitoring and load diagnostics as well

as protection features against over current and

over temperature. Fault conditions are indicated on

nFAULT pin. The devices are available in three

variants - hardwired interface: HW (H) and two SPI

interface variants: SPI(P) and SPI(S), with SPI (P)

for externally supplied logic supply and SPI (S) for

internally generated logic supply. The SPI interface

variants offer more flexibility in device configuration

and fault observability.