位置:H5AN4G4NBJR-XXC > H5AN4G4NBJR-XXC详情
H5AN4G4NBJR-XXC中文资料
H5AN4G4NBJR-XXC数据手册规格书PDF详情
FEATURES
• VDD=VDDQ=1.2V +/- 0.06V
• Fully differential clock inputs (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• On chip DLL align DQ, DQS and DQS transition with CK
transition
• DM masks write data-in at the both rising and falling
edges of the data strobe
• All addresses and control inputs except data, data
strobes and data masks latched on the rising edges of
the clock
• Programmable CAS latency 9, 11, 12, 13, 14, 15, 16,
17, 18, 19 and 20
• Programmable additive latency 0, CL-1, and CL-2
supported (x4/x8 only)
• Programmable CAS Write latency (CWL) = 9, 10, 11,
12, 14, 16, 18
• Programmable burst length 4/8 with both nibble
sequential and interleave mode
• BL switch on the fly
• 16banks
• Average Refresh Cycle (Tcase of 0 oC~ 95 oC)
- 7.8 μs at 0oC ~ 85 oC
- 3.9 μs at 85oC ~ 95 oC
• Operating Temperture Range
- Commercial Temperature (0 oC~ 95 oC)
- Industrial Temperature (-40oC~ 95 oC)
• JEDEC standard 78ball FBGA(x4/x8), 96ball FBGA(x16)
• Driver strength selected by MRS
• Dynamic On Die Termination supported
• Two Termination States such as RTT_PARK and
RTT_NOM switchable by ODT pin
• Asynchronous RESET pin supported
• ZQ calibration supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• 8 bit pre-fetch
• This product in compliance with the RoHS directive.
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• Maximum Power Saving Mode is supported
• TCAR(Temperature Controlled Auto Refresh) mode is
supported
• LP ASR(Low Power Auto Self Refresh) mode is supported
• Fine Granularity Refresh is supported
• Per DRAM Addressability is supported
• Geardown Mode(1/2 rate, 1/4 rate) is supported
• Programable Preamble for read and write is supported
• Self Refresh Abort is supported
• CA parity (Command/Address Parity) mode is supported
• Bank Grouping is applied, and CAS to CAS latency
(tCCD_L, tCCD_S) for the banks in the same or different
bank group accesses are available
• DBI(Data Bus Inversion) is supported(x8/x16)
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
HYN |
23+ |
NA |
282 |
专做原装正品,假一罚百! |
|||
SKHYNIX |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
SKHYNIX |
23+ |
BGA |
6500 |
专注配单,只做原装进口现货 |
|||
SKHYNIX |
23+ |
BGA |
6500 |
专注配单,只做原装进口现货 |
|||
SKHYNIX |
23+ |
FBGA |
28942 |
原盒原标,正品现货 诚信经营 价格美丽 假一罚十 |
|||
SKHYNIX |
1844+ |
BGA |
6528 |
只做原装正品假一赔十为客户做到零风险!! |
|||
SKHYNIX |
23+ |
BGA |
20000 |
原厂原装正品现货 |
|||
SKHYNIX |
2023+ |
BGA |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
|||
SKHYNIX |
21+ |
BGA |
35200 |
一级代理/放心采购 |
|||
SKHYNIX |
21+ |
BGA |
20000 |
只做正品原装现货 |
H5AN4G4NBJR-XXC 资料下载更多...
H5AN4G4NBJR-XXC 芯片相关型号
- 2SD2217
- BSP170PL6327
- DSP56300
- DSP56300FM/AD
- DSP56301
- H5AN4G4NBJR
- H5AN4G6NBJR-XXC
- H5AN4G6NBJR-XXI
- LCMXO2-640
- LCMXO2-640HC
- M24512-W
- M24C02-R
- MPC8280
- MPC8280CVRBX
- MPC8280CVREX
- MPC8280CVRFX
- MPC8280CVRIX
- MPC8280CVRMX
- MPC8280CVRPX
- MPC8280CVRTX
- MPC8280CVVBX
- MS27468T17F13BAML
- MS27468T17F13BBML
- MS27468T17F13BCML
- MS27468T17F13PAML
- MS27468T17F13PBML
- MS27656T15F13AAML
- SFH690AB_V02
- SFH690B
- SFH690B-X001
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86