型号 功能描述 生产厂家&企业 LOGO 操作

Heyco®LiquidTightStrainReliefBushings

TheUltimateinSnap-InStrainReliefProtection Snap-in,LowProfileDesignallowsforPre-assembledCables •Theselowprofileco-moldednylonand elastomerpartsfunctionasaLiquid TightStrainReliefwithacable. •cULusapprovedunderUL514B. •Lowprofiledesign:heightabovepan

Heyco

Heyco

Heyco

LongitudinalMeasuringPinM5forcontactfreemeasurementofcavityandinjectionpressures

•Compactinstallationsize •Contact-freemeasurementofhighpressures •Cavitypressuremeasurementbehindthecavitywall,without imprint •Indirectmeasurementofinjectionpressureinthenozzle

KISTLERKISTLER INSTRUMENT CORPORATION

奇石乐奇石乐集团

KISTLER

Inst,2Pr#18StrBC,PVC-NYLInsE1,OS,BlkPVCJkt,600VTC-ER150VNPLF90CDry/Wet

ProductDescription ULInstrumentation,2Pair18AWG(7x26)BareCopper,PVC-NYLInsulationE1ColorCode,OverallBeldfoil®Shield,BlackPVCOuterJacket,600VTC-ER 150VNPLF90CDry/WetSUNRESDIRBUR

BELDEN

Belden Inc.

BELDEN

Inst,2Pr#18StrBC,XLPEInsE1,OS,BlkLSZHPEJkt,600VTC90CDry/WetSUNRESDIRBUR

ProductDescription ULInstrumentation,2Pair18AWG(7x26)BareCopper,XLPEInsulationE1ColorCode,OverallBeldfoil®Shield,BlackLSZHPEOuterJacket,600VTC90C Dry/WetSUNRESDIRBUR

BELDEN

Belden Inc.

BELDEN

5TO1000MHzTO-8CASCADABLEAMPLIFIERS

文件:178.35 Kbytes Page:2 Pages

TELEDYNE

TELEDYNE

TELEDYNE

S-1063-SP产品属性

  • 类型

    描述

  • 型号

    S-1063-SP

  • 制造商

    Molex

更新时间:2024-5-26 8:00:02
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
HITTITE
QFN
6698
MOLEX/莫仕
21+
3P
120000
长期代理优势供应
ADI/亚德诺
21+
原封装
13880
公司只售原装 支持实单
TAMAWIRA
2023+
SMD
80000
一级代理/分销渠道价格优势 十年芯程一路只做原装正品
QORVO
22+
36000
原装现货假一赔十
Analog Devices
24+
EvaluationBoard
33680
ADI优势主营型号-原装正品
TAMAWIRA
24+
SMD
990000
明嘉莱只做原装正品现货
HITTITE射频全系列
23+
NA
1098
正迈科技专注射频优势原装供应MACOMMINIHITTITE等品牌
ADI/亚德诺
21+
原封装
13880
公司只售原装,支持实单
TE
NA
49677
一级代理 原装正品假一罚十价格优势长期供货

S-1063-SP芯片相关品牌

  • ANACHIP
  • BOTHHAND
  • EUROQUARTZ
  • Honeywell
  • MOLEX8
  • MPS
  • nichicon
  • nxp
  • POWERBOX
  • RECTRON
  • TAI-TECH
  • Winbond

S-1063-SP数据表相关新闻